A breakthrough in conducting heat for electronics

Tao Deng

Hello everybody! I just wanted to post today to let you know about some exciting news from the Nanotechnology team. We’ve recently been working under a DARPA contract and have developed and demonstrated a prototype phase-change based thermal materials system that conducts heat much better than copper. As a background, copper has been the preferred material used to cool electronics since the dawn of the electronics age. So, what does this new development mean exactly?

Well, we’ve developed a thermal materials system that could be used in high-speed electronics that will help better keep those electronics from overheating. Less overheating means that you can get more power from your gadgets. Imagine more advanced radar systems, better aviation and marine electronic control systems, and the icing on the cake—faster laptops!

As electronics become more advanced, we are approaching the point where conventional materials like copper simply can’t take the heat. For computing to go faster and electronic systems to become more capable, better cooling solutions will be needed to allow this to happen.

The thermal materials system works when applied to computer chips and a variety of different electronic components. It takes the heat generated in the electronic systems and spreads that heat out to keep them cool.

In demonstrations, the prototype system has functioned effectively in a variety of electronics and application environments. We also subjected it to harsh conditions during testing and found it could successfully operate in extremely high gravity applications. More specifically, the prototype has operated in conditions that simulate more than 10 times the normal force of gravity! By comparison, this gravity force is more than four times greater than what someone would experience on the Mission Space ride at Disney. Do you think you could run at the same speed when feeling the 10x the normal weight of gravity? Most likely not; but our prototype can.

Attached is an infographic that helps to explain some of the key components of this prototype system. Currently it has more than twice the thermal conductivity and can operate at 10 times normal gravity – we are working on to further push up these performances Another unique property is that it is one-fourth the weight of copper! All of these properties combined make it an attractive option for a variety of different systems ranging from personal laptops to the sophisticated avionics and electronic control systems that operate a 747 aircraft.

Comments

If the sea water were pooled 1st, it could be salted; salt lifted or trucked from a mine. This would raise the boiling temperature of the sea water. IDK about corrossion or volatile gases.

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Forgive my ignorance, but is this material’s high gravity performance unique? I would guess that copper (and other heat dissapating materials) operate under high gravity as well. Or are you trying to say that this material is very rigid, whereas copper is too malleable for certain applications?

Are there any technical papers about this material? I’m a chemist and would enjoy learning about what this material is and how it does its magic.

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I am really interested and want to understand more abt that material! Where can I go and read detail about your work? Did you patent it already?

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@Sibo and @NL — Thanks for your interest! There are two publications that are co-authored by Tao Deng (along with some additional researchers) that you can review to learn more about the technical specs of this project. Hope this helps!

1. De Bock, H. P. J.; Chamarthy, P.; Chauhan, S;Weaver, S. A.; Deng, T. “On the Charging and Thermal Characterization of a Micro/Nano Structured Thermal Ground Plane”, Proceedings of the 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2010, Las Vegas, Nevada, USA.

2. Varanasi, K.; Chamarthy, P.; de Bock, P.; Denault, L.; Deng, T.; Knoblock, A.; Kulkarni, A.; Rush, B.; Russ B.; Weaver, S. “High Performance Heat Transfer Device, Methods of Manufacture Thereof and Articles Comprising the Same”, US 12/470624, 2009.

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Very neat idea. Which materials are used in this substrate? How difficult is to make it for large scale? Is it safe to use to be in contact with food?

This is good news for people using Electronic gadgets and other stuff. It can prevent the rapid heating of a certain computer or laptop. It can also help prevent future damages.

Good news for thermal engineer like me. Two questions about the new product:
1,what is the max heat flux of the product?
2,how is the performance vary when 10x gravity?

Can this new thermal material reduce the heat generated by LED drivers, thus extending the llfe of the originally designed light level?

The post is really informative, you have discussed the primary things that one should kept in mind There are numerous ways you have stuffed here and shared.
Interactive Boards

Electronics from overheating, this is going to help a lot! Congo Nanotechnology team! Plumbing

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